Process and apparatus for preparing a flat-topped wave-board panel
US5000673A · kind A · utility
19Cited by
8References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1989 |
| Grant date | Mar 19, 1991 |
| Priority date | — |
| Expiry date | Apr 24, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB30B15/062
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A platen assembly is provided for manufacturing flat-topped wave-board. The assembly can be mechanically converted between a planar configuration and a wave-like configuration to form a board with a flat-topped and bottomed profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.