Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin
US5001174A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1989 |
| Grant date | Mar 19, 1991 |
| Priority date | — |
| Expiry date | Dec 4, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for semiconductor sealing which comprises, as essential components, PA1 (A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR1## wherein n and m are each an integer of 0 or more, n+m=1-10, and R.sub.1, R.sub.2 and R.sub.3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of R.sub.1, R.sub.2 and R.sub.3 must not be hydrogen atom simultaneously, PA1 (B) a phenolic resin curing agent, PA1 (C) a silica filler, and PA1 (D) a curing accelerator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.