Thermoplastic molding compositions
US5001178A · kind A · utility
3Cited by
21References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1989 |
| Grant date | Mar 19, 1991 |
| Priority date | — |
| Expiry date | Mar 6, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic blend compositions comprise a crystalline polyalkylene terephthalate, a styrenic polymer component, and a diepoxide. The styrenic polymer component comprises a rigid portion formed from at least one monomer selected from the group consisting of styrene, halogen-substituted styrene, alpha-methyl styrene and para-methyl styrene, and at least one additional ethylenically unsaturated monomer, and a rubber portion including polybutadiene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.