Patent · US Expired

Recyclable hot melt adhesive compositions

US5001179A · kind A · utility

18Cited by
21References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 13, 1989
Grant dateMar 19, 1991
Priority date
Expiry dateJan 13, 2009

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J153/025
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Recyclable hot melt adhesive compositions suitable for plastic bonding may be prepared from styrene-ethylene-butylene-styrene tri-block and/or styrene-ethylene-butylene di-block copolymers which are tackified with at least one hydrogenated resin based on alpha-methyl styrene, vinyl toluene, styrene, coumarone-indene, dicyclopentadiene or mixtures thereof, optionally containing small amounts of white mineral oil or similar diluent. In addition, the adhesive may or may not include minor amounts of the above-described pure monomer resins (specifically composed of styrene, alpha methyl styrene or vinyl toluene or mixtures thereof) in their non-hydrogenated form to serve as end block reinforcing resins.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.