Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US5001542A · kind A · utility
136Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1989 |
| Grant date | Mar 19, 1991 |
| Priority date | — |
| Expiry date | Nov 30, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1163
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.