Product in tape form for supporting and conveying electronic components
US5001544A · kind A · utility
6Cited by
4References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 19, 1988 |
| Grant date | Mar 19, 1991 |
| Priority date | — |
| Expiry date | Oct 19, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The produce comprises an electrically conductive tape cut out or etched so as to form windows from which connecting tabs for a chip project, according to the "single-layer" T.A.B. technology. An adhesive tape is glued to the conductive tape and pierced with windows centered on and lying within the conductive tape's windows. According to the invention, apertures isolate the connecting tabs for the purpose of applying test signals to the chip by means of the tabs then carried by the adhesive tape alone. The invention is used for testing integrated power circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.