Self centering buff pad with low temperature tuft bonding thermoplastic adhesive
US5001804A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1989 |
| Grant date | Mar 26, 1991 |
| Priority date | — |
| Expiry date | Nov 13, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/23993
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A buff adapted for self centering engagement with a backup pad comprising a circular body with a first fastener portion on its face surface. The buff includes a stiff flexible backing having a generally planar circular central portion and an annular flange only slightly larger than the diameter of the backup pad projecting from one side surface of its central portion, a second fastener portion fixed on the side surface of its central portion and adapted for engagement with the fastener portion on the backup pad, and a multiplicity of projecting tufts having central portions adhered in the backing by a thermoplastic adhesive that melts and adheres at a temperature under 100.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.