Tunnel artery wick for high power density surfaces
US5002122A · kind A · utility
50Cited by
13References
26Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 25, 1984 |
| Grant date | Mar 26, 1991 |
| Priority date | — |
| Expiry date | Sep 25, 2004 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0233
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer surface structure for cooling high power density surfaces and the method of constructing it. The surface includes a sintered capillary layer with a complex configuration of tunnels within it constructed adjacent to the heated surface which is subject to very high power densities. The tunnel arteries serve to supply evaporable liquid and remove vapor to provide the cooling. A unique method of constructing the tunneled sintered layer is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.