Bonding method and bonding apparatus
US5002217A · kind A · utility
11Cited by
6References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 28, 1989 |
| Grant date | Mar 26, 1991 |
| Priority date | — |
| Expiry date | Sep 28, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20304
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding method and apparatus for bonding a wire material having a ball-like end on a bonding pad is disclosed. While the ball of the wire material on the bonding pad is being pressed by a bonding tip, an ultrasonic wave and a high frequency current are applied in combination to the bonding tip so as to improve strength of the bonding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.