Aluminum plating substance for anodizing
US5002838A · kind A · utility
3Cited by
4References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1989 |
| Grant date | Mar 26, 1991 |
| Priority date | — |
| Expiry date | Aug 14, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12757
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An aluminum plating material to be anodized comprising a substrate, a metal layer formed on the substrate, the metal layer being electrochemically nobler than aluminum and an aluminum alloy, and an aluminum layer formed on the metal layer. The aluminum plating material prevents peeling of an aluminum layer from the substrate upon anodizing, which allows formation of uniform pores of the anodizing film, and which provides good coloring and anitiwear properties of the anodized film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.