Patent · US Expired

Heat-curable bismaleimide-alkenyl heterocyclic molding material

US5003017A · kind A · utility

7Cited by

3References

2Claims

0Family size

Assignee

BASF SE

Inventors

Philipp Eisenbarth · Bad Dürkheim, DE
Gerd Linden · Heidelberg, DE
Volker Altstaedt · Gernsheim, DE
Roland Peter · Mutterstadt, DE

Key dates

Filing date	Jul 26, 1989
Grant date	Mar 26, 1991
Priority date	—
Expiry date	Jul 26, 2009

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08J2379/08
WIPO fieldOrganic fine chemistry
WIPO sectorChemistry

Abstract

Heat-curable bismaleimide resins contain a bismaleimide and a heterocyclic comonomer having terminal alkenyl or alkenyloxy groups. A preferred comonomer is 2,6-bis-(2-propenylphenoxy)-pyridine. The bismaleimide resins are suitable for the production of high performance composites.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.