Amino phenyl containing curing agent for high performance phthalonitrile resin
US5003039A · kind A · utility
34Cited by
14References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 18, 1988 |
| Grant date | Mar 26, 1991 |
| Priority date | — |
| Expiry date | Nov 18, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/0655
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
High temperature polymeric materials, which are easily process into void-free components, are needed for use in composites for advanced aerospace applications. These materials could bridge the gap between currently-used polymeric materials and ceramics or metal. Phthalonitrile resins can be used as high temperature polymeric material and 1,3-bis(3-aminophenoxy)benzene can be used as a curing agent to reduce voids and benzene can be used as a curing agent to reduce voids and blisters formed from volatiles during polymerization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.