Dispersion strengthened copper-base alloy for overlay
US5004581A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1990 |
| Grant date | Apr 2, 1991 |
| Priority date | — |
| Expiry date | Jul 30, 2010 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C2223/46
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %, PA0 Ni: 5 to 30%; PA0 B: 0.5 to 3%; PA0 Si: 1 to 5%; PA0 Fe: 4 to 30%; PA0 Sn: 3 to 15% and/or An: 3 to 30%; and the remainder being Cu and unavoidable impurities, and has a structure in which particles of boride and silicide of the Fe-Ni system are dispersed in a Cu-base matrix, and Cu-base primary crystals contain Sn and/or Zn in a solid solution state. If necessary, 0.1 to 5% of Al, 0.1 to 5% of Ti, and/or 1 to 10% of Mn may be added. 0.02 to 2% of C, and 0.1 to 10% of Cr and/or 0.3 to 5% of Ti may be further added. Instead of or along with Sn and/or Zn, 2 to 20% of Pb can be used, and nonsoluble Pb particles are uniformly dispersed between Cu-base .alpha. phase dendrites and serve as a solid lubricant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.