Electrophoretic method for applying photoresist to three dimensional circuit board substrate
US5004672A · kind A · utility
24Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1989 |
| Grant date | Apr 2, 1991 |
| Priority date | — |
| Expiry date | Jul 10, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby (a) providing the board with a conductive surface and (b) applying a photoresist by electrophoretic deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.