Low density heat resistant intermetallic alloys of the Al.sub.3 Ti type
US5006054A · kind A · utility
5Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 1989 |
| Grant date | Apr 9, 1991 |
| Priority date | — |
| Expiry date | Mar 30, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C14/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Low density, high temperature and aluminum-rich intermetallic alloys displaying excellent elevated temperature properties, including oxidation resistance, are disclosed. Based on the aluminum/titanium system, specifically modifications of Al.sub.3 Ti compositions, useful alloys are derived from changes in crystal structure and properties effected by selected-site substitution alloying with manganese and/or chromium, and, where used, vanadium, or equivalent site-substituting alloying elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.