Curable epoxy resin compositions of matter containing a thermoplastic which has phenolic end groups
US5006611A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1990 |
| Grant date | Apr 9, 1991 |
| Priority date | — |
| Expiry date | Jan 11, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat-curable compositions of matter which are stable on storage and which contain PA1 (a) 10-70 parts by weight of an epoxy resin having a functionality of at least 3, PA1 (b) 90-30 parts by weight of an epoxy resin having a functionality of 2-2.5, PA1 (c) a diphenol, the amount of the diphenol being so chosen that 0.6-1.2 hydroxyl equivalents of the diphenol (c) are employed per epoxide equivalent of the epoxy resins (a) and (b), and PA1 (d) 10-150 parts by weight, relative to 100 parts by weight of the components (a) to (c), of a thermoplastic having phenolic end groups and having a glass transition temperature of at least 150.degree. C. which is compatible with the mixture of the components (a) to (c), are particularly suitable for the production of prepregs for fiber-reinforced composite materials or for the production of adhesive films. The cured shaped articles obtained therefrom are distinguished by a high heat distortion point and excellent mechanical strength properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.