Stackable multilayer substrate for mounting integrated circuits
US5006923A · kind A · utility
20Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 14, 1989 |
| Grant date | Apr 9, 1991 |
| Priority date | — |
| Expiry date | Sep 14, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate is formed from a core substrate of flexible, low-temperature co-fireable ceramic tape and an outer substrate of ceramic tape having apertures for receiving integrated circuits (ICs) therein. The substrate is heated to form a rigid body which then mounts the ICs. The rigid body and ICs are covered or at least partially covered with an insulating glass and heated to a temperature that fuses the glass but does not harm to ICs. The resulting structure hermetically seals the ICs in a single substrate that is insensitive to acceleration forces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.