Lead type chip capacitor and process for producing the same
US5006953A · kind A · utility
4Cited by
6References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1989 |
| Grant date | Apr 9, 1991 |
| Priority date | — |
| Expiry date | Jul 25, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/2325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lead type chip capacitor which is disclosed herein comprises a capacitor chip having a lead terminal bonded thereto through a joining or bonding layer made of a highly melting metal paste. The lead type chip capacitor is produced by bonding at least one internal electrode in a capacitor chip with a lead terminal by a metal paste, drying them at a temperature in a range of 100.degree. to 200.degree. C., and firing the resulting capacitor chip with the lead terminal bonded thereto at a temperature in a range of 500.degree. to 900.degree. C. in the air or in a nitrogen atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.