Patent · US Expired

Modular higher density communications coupling system

US5007860A · kind A · utility

106Cited by
6References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 19, 1990
Grant dateApr 16, 1991
Priority date
Expiry dateJan 19, 2010

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R2201/16
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A modular higher density communications coupling system including a universal platform for supporting multiple connectors from a single outlet hole is disclosed. The platform includes a main body member having a registration ridge extending forward of the main body member for extending into a standard sized outlet hole. A pair of apertures adjacent to each other extend through the main body member and are generally surrounded by the registration ridge. A pair of connector housings are attachable to the rear of the platform in alignment with the aperatures for housing connectors. A pair of retaining members on two sides of the apertures hold the connector housings in position. A pair of support members extend rearwardly from the main body of the platform on the other two sides of the apertures. A termination plate is mounted in the support members, the termination plate having a plurality of electrical couplings for connecting the wire from a wall to the connector. A grounding screw mount provides easy access from the front, side or rear. The relationship between the retaining members, apertures, and support members facilitates a higher density of electrical couplings than previousl…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.