Balancing putty
US5008309A · kind A · utility
6Cited by
2References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 20, 1989 |
| Grant date | Apr 16, 1991 |
| Priority date | — |
| Expiry date | Apr 20, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A balancing putty for use in balancing rotation of a rotary part including: PA0 (a) an epoxy resin; PA0 (b) a curing agent capable of curing the epoxy resin when heated at a temperature of 60.degree. C. or more, PA0 (c) a first, finely divided inorganic filler having a specific gravity of 4.0 g/cm.sup.3 or more; and PA0 (d) a second, finely divided inorganic filler having a specific gravity of less than 4.0 g/cm.sup.3, the balancing putty having a density of at least 2.0 g/cm.sup.3 and a consistency of 1-12 mm in terms of penetration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.