Radiofrequency wave treatment of a material using a selected sequence of modes
US5008506A · kind A · utility
64Cited by
10References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1989 |
| Grant date | Apr 16, 1991 |
| Priority date | — |
| Expiry date | Oct 30, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/705
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A radiofrequency wave apparatus including an applicator (112, 120) which provides multiple, sequenced processing modes for use in a method for heating a material is described. The modes in the applicator are selected to suit each stage of the processing of a material (B). The apparatus can include multiple circuits (11, 12 and 13) which couple the radiofrequency waves to the applicator using probes (111a, 121a and 122a) in the method. The result is the optimum processing of the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.