Thermal protection method for a power device
US5008736A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1989 |
| Grant date | Apr 16, 1991 |
| Priority date | — |
| Expiry date | Nov 20, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermally protected power transistor comprising a first chip which includes a power transistor and a second chip which includes protection circuitry. The second chip has a plurality of metallic bumps formed thereon which are coupled to various portions of the protection circuitry, wherein at least one metallic bump serves as a thermal couple. The protection circuitry chip is mounted upside down on the power transistor chip and coupled to the power transistor chip by the metallic bumps. The metallic bumps serve to provide electrical power for the protection circuitry, to couple control signals between the protection circuitry and the power transistor, and to couple thermal information from the power transistor to the protection circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.