Diamond composite heat sink for use with semiconductor devices
US5008737A · kind A · utility
47Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1988 |
| Grant date | Apr 16, 1991 |
| Priority date | — |
| Expiry date | Oct 11, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A composite comprised of diamond particles embedded in a metal matrix is a highly satisfactory heat sink material for use with a semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.