Joining of ceramic components to metal components
US5009357A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1989 |
| Grant date | Apr 23, 1991 |
| Priority date | — |
| Expiry date | Jul 25, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/78
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention provides a method of joining together a ceramic component and a metal component. According to the invention a surface of the ceramic component is metallized with a metallizing metal to form a metallized layer thereon. The metal component is then thermocompression bonded to the metallized layer, optionally after the metallized layer is plated with a continuous metal layer. For electrochemical cell applications, the ceramic component is typically alpha-alumina, the metal of the metallized layer is typically selected from tantalum, titanium, vanadium, tungsten and molybdenum, and the metal component typically comprises, in metallic or alloy form, at least one of iron, nickel, cobalt, chromium, manganese or copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.