Soldering apparatus and method of using the same
US5010227A · kind A · utility
3Cited by
12References
20Claims
0Family size
Inventor
Key dates
| Filing date | Feb 15, 1989 |
| Grant date | Apr 23, 1991 |
| Priority date | — |
| Expiry date | Feb 15, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/047
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering apparatus includes a holding device, which is composed of a ceramic material and fits over and covers partially, a thermod having an electrically grounded conductor portion to distribute heat uniformly to a soldering surface. The soldering apparatus is moved so that the thermod engages the surface to be soldered. Thermal energies are then uniformly transferred by the thermod to heat the connecting joint to soldering temperature and for heating a solder bead for soldering purposes. After soldering, the apparatus is retracted, or the current is turned off, to permit the surface to cool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.