Divided capacitor mounting pads
US5010447A · kind A · utility
13Cited by
1References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 28, 1988 |
| Grant date | Apr 23, 1991 |
| Priority date | — |
| Expiry date | Dec 28, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A split bonding pad provides a positive electrical indication of the proper electrical and mechanical connection of a capacitor to a printed circuit board by placing the electrical component terminal in series with electrical power supplied to a memory device while the electrical component remains in parallel connection with the memory device power lead. The proper mounting of the electrical component to the board becomes testable by testing continuity of a series circuit through the leads extending to the split bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.