Dotted contact solar cell and method of making same
US5011565A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 1990 |
| Grant date | Apr 30, 1991 |
| Priority date | — |
| Expiry date | May 17, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
A method of applying metallized contacts to a solar cell substrate, the front surface of which is covered with a dielectric layer. The method involves forming a plurality of apertures extending through the dielectric layer using a laser beam and defining a grid-shaped electrode. The apertures comprise a plurality of microscopically-sized holes that are arranged in a series of rows, with the holes being spaced a relatively short distance from one another. Nickel is plated onto the portions of the substrate exposed through the apertures. The nickel plating is then overcoated with copper which is preferably applied by a contactless light-induced plating process. The copper plating process causes copper to be deposited so that it bridges over the dielectric layer between the holes so as to form an integrated grid electrode structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.