Bulk polymerized cycloolefin circuit boards
US5011730A · kind A · utility
27Cited by
55References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1989 |
| Grant date | Apr 30, 1991 |
| Priority date | — |
| Expiry date | Apr 11, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Dielectric supports for electronic components, such as circuit boards, are provided which are comprised of two or more bulk polymerized norbornene-type monomers. The monomers may be easily processed into circuit boards, etc. by reaction injection molding. The copolymers obtained exhibit high heat distortion temperatures and good dielectric properties and a balance of properties that make them, for example, well suited for molded wire board materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.