Patent · US Expired

Process for producing modified phenolic resin bonding agents and use thereof for producing particle board

US5011886A · kind A · utility

6Cited by
12References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 26, 1990
Grant dateApr 30, 1991
Priority date
Expiry dateFeb 26, 2010

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08G14/08
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The inventive concept is to condense the phenol formaldehyde resins to a higher molecular weight than usual so far. Subsequent addition of urea thereto reduces viscosity to normal levels and increases solid content. The added urea does not take part in condensation reaction but partly reacts in the alkaline medium with formaldehyde to methylol urea (in a so called equilibrium reaction), which is formaldehyde donor for the phenol formaldehyde crosslinking reaction during the pressing of the particle board. The present invention relates to a process for producing modified phenolic resin bonding agents, characterized by preparing as known per se phenol-formaldehyde resins with a viscosity of more than 300 mPa.s (at 20.degree. C.) and with a solids content of from 65 weight percent and adding to the viscous phenolic resin solutions obtained 5 to 50 weight percent urea, based on the weight of the phenolic resin solution, the phenol formaldehyde resins being prepared with as much alkali as is required to secure that the modified resin solution resulting therefrom contains 2 to 12 weight percent total alkali calculated as NaOH. The solids content of the modified resin solutions ranges of …

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.