Patent · US Expired

Flat body, particularly for use as a heat sink for electronic power components

US5012324A · kind A · utility

6Cited by

3References

17Claims

0Family size

Assignee

Doduco GmbH & Co., Dr. Eugen Durrwachter · DE

Inventors

Wolfram Martin · Ilsfeld, DE
Brigitte Waibel · Pforzheim, DE

Key dates

Filing date	Feb 24, 1989
Grant date	Apr 30, 1991
Priority date	—
Expiry date	Feb 24, 2009

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The bodies consist of a ceramic slab (1), which is covered on both sides by metal plates (2, 3), which are firmly bonded to the ceramic slab (1) throughout their contact surface without an interlayer and have marginal strips (5) which are reduced in thickness.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.