Method for the manufacture of layered capacitors having a thickness of inactive layers
US5012565A · kind A · utility
3Cited by
2References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 21, 1989 |
| Grant date | May 7, 1991 |
| Priority date | — |
| Expiry date | Dec 21, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G13/02
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Metallized dielectric film is employed to manufacture capacitors. In order to attach a certain number of inactive layers to the capacitors, the method comprises a stage which consists in displacing the layers laterally during the winding operation in order to obtain a determined thickness of inactive layers, the lateral displacement causing the prevention of the connection of the metallizations of the films to the lateral Schoop coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.