Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit
US5012858A · kind A · utility
16Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1989 |
| Grant date | May 7, 1991 |
| Priority date | — |
| Expiry date | Apr 10, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.