Thermoplastic methacrylimide group-containing resin composition
US5013774A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1989 |
| Grant date | May 7, 1991 |
| Priority date | — |
| Expiry date | Mar 7, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/3435
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic methacrylimide group-containing resin composition comprised of (a) a methacrylimide group-containing polymer comprising 5 to 100% by weight of units of an imide ring structure represented by the following structural formula (I): ##STR1## wherein R.sub.1 stands for a hydrogen atom, a substituted or unsubstituted alkyl, cycloalkyl, aryl, alkaryl, aralkyl or allyl group having 1 to 20 carbon atoms, PA0 and 0 to 95% by weight of units derived from at least one monoethylenically unsaturated monomer, and (b) a small amount of a tetramethylpiperidine derivative is described. A shaped article made from this composition has a highly improved weatherability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.