Patent · US Expired

Filler-containing polyamide molding materials having an improved surface and improved coatability

US5013786A · kind A · utility

6Cited by

12References

5Claims

0Family size

Assignee

BASF SE

Inventors

Robert Payne · Wellesley, US
Walter Goetz · Ludwigshafen, DE
Uwe Wolf · Magdala, DE

Key dates

Filing date	Feb 10, 1989
Grant date	May 7, 1991
Priority date	—
Expiry date	Feb 10, 2009

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Filler-containing thermoplastic molding materials having an improved surface and improved coatability contain, as essential components, PA0 (A) from 42 to 90% by weight of a thermoplastic polyamide, PA0 (B) from 9.5 to 55% by weight of fibrous or particulate fillers or mixtures of these and PA0 (C) from 0.5 to 3% by weight of a rubber impact modifier having reactive groups.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.