Test probe manipulator for wafer-probing apparatus
US5014001A · kind A · utility
5Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 1990 |
| Grant date | May 7, 1991 |
| Priority date | — |
| Expiry date | May 14, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06705
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The test-probe manipulator for a test probe for use with semiconductor wafers utilizes three adjusting spindles (50,51,52) arranged on the same side of the manipulator. The test-probe manipulator occupies little space and is easy to operate. All three axes of translational freedom perform linear motions independent of each other. Accuracy of adjustment is improved as compared to conventional devices. Easy placement on and removal from a test platform are ensured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.