Patent · US Expired

Test probe manipulator for wafer-probing apparatus

US5014001A · kind A · utility

5Cited by
9References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 14, 1990
Grant dateMay 7, 1991
Priority date
Expiry dateMay 14, 2010

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R1/06705
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The test-probe manipulator for a test probe for use with semiconductor wafers utilizes three adjusting spindles (50,51,52) arranged on the same side of the manipulator. The test-probe manipulator occupies little space and is easy to operate. All three axes of translational freedom perform linear motions independent of each other. Accuracy of adjustment is improved as compared to conventional devices. Easy placement on and removal from a test platform are ensured.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.