Semiconductor device for a ram disposed on chip so as to minimize distances of signal paths between the logic circuits and memory circuit
US5014242A · kind A · utility
51Cited by
11References
15Claims
0Family size
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Inventors
Key dates
| Filing date | Dec 8, 1988 |
| Grant date | May 7, 1991 |
| Priority date | — |
| Expiry date | Dec 8, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K5/2418
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a semiconductor integrated circuit wherein a logic circuit for exchanging signals with RAMS, with the RAMS being disposed centrally on the semiconductor chip or substrate, is divided into a plurality of logic circuits in accordance with the kind of signals and the divided logic circuits are disposed around the RAM in such a manner as to minimize the distance of signal transmission paths with the RAM and in order to attain high speed access to RAMS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.