Method of forming a two piece chip carrier
US5014418A · kind A · utility
22Cited by
20References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 11, 1990 |
| Grant date | May 14, 1991 |
| Priority date | — |
| Expiry date | Jun 11, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A hermetically sealed chip carrier including a lead frame for use with an EEPROM chip, the carrier including a pre-molded plastic base and a metal cover having an aperture into which has been poured an ultra-violet glass window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.