Board-mounted thermal path connector and cold plate
US5014904A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 16, 1990 |
| Grant date | May 14, 1991 |
| Priority date | — |
| Expiry date | Jan 16, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses an improved method and apparatus for dissipating heat from printed circuit boards and electronic devices mounted thereon. Printed circuit boards are provided with apertures therethrough for receiving thermal conductor pads. The thermal conductor pads may be secured in the apertures through the use of glue or by means of an interference fit. Glue may also be deposited on top of the thermal conductor pad to secure an electronic device thereto. The glue is cured in a manner that limits its thickness to a minimum value. The electronic device may be further secured to the printed circuit board by wave soldering. The opposite end of the thermal conductor pad contacts the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.