Textured polyimide film
US5015517A · kind A · utility
7Cited by
3References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 22, 1987 |
| Grant date | May 14, 1991 |
| Priority date | — |
| Expiry date | Oct 22, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One or both surfaces of a polyimide sheet are uniformly and completely textured and can be coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers can be strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.