Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators
US5015675A · kind A · utility
15Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1989 |
| Grant date | May 14, 1991 |
| Priority date | — |
| Expiry date | Jul 31, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/36
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.