Method of cutting workpiece
US5016800A · kind A · utility
Inventors
Key dates
| Filing date | Aug 23, 1990 |
| Grant date | May 21, 1991 |
| Priority date | — |
| Expiry date | Aug 23, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/371
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for cutting workpiece made of such a glass or ceramic material having relatively large thickness. A workpiece having one surface on which an incision is previously formed is placed on a flat plate which has a Young's modulus smaller than that of the workpiece and which is placed on a surface plate, so that the surface having the incision of the workpiece faces the upper surface of the flat plate. A pressing load is then applied downwardly through a pressing member to the surface opposite to the surface having the incision of the workpiece locally along the incision. The workpiece is thus cut by the bending moment due to the difference of the Young's moduli of the workpiece and the flat plate without generating noises or forming chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.