Laser sputtering apparatus
US5017277A · kind A · utility
22Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1989 |
| Grant date | May 21, 1991 |
| Priority date | — |
| Expiry date | Jul 6, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laser sputtering apparatus has a vacuum chamber, a target holder installed in the vacuum chamber, arranged to oppose the target in the vacuum chamber, a substrate mounted on the substrate support, and a laser beam source which emits laser beams onto the target through a window provided in the vacuum chamber wall, providing a laser sputtering apparatus that supplies dielectric thin films with a high permittivity and a high withstanding voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.