Resin composition
US5017663A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1990 |
| Grant date | May 21, 1991 |
| Priority date | — |
| Expiry date | Apr 18, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a thermoplastic resin composition which is improved in compatibility between polyphenylene ether and polyamide and is excellent in processability and impact strength. This resin composition comprises: PA1 100 parts by weight of a composition comprising PA2 (A) 5-95% by weight of a polyphenylene ether resin and PA2 (B) 95-5% by weight of a polyamide and 0.01-10 parts by weight, based on said composition comprising (A) and (B), of (D) a compound comprising dinitrodiamine represented by the formula (I): ##STR1## wherein X represents a divalent chain aliphatic, cycloaliphatic or aromatic group which may contain halogen or oxygen, R.sup.1 represents a hydrogen atom, a chain aliphatic group, a cycloaliphatic group or an aromatic group and when X and R.sup.1 are both chain aliphatic groups, the nitrogen atoms may further link to each other through R.sup.1 ; R.sup.2 and R.sup.3 each represents a hydrogen atom or an alkyl group of 1-12 carbon atoms and R.sup.2 and R.sup.3 may link to each other to form a ring. Preferably this composition further contains a rubber-like polymer for remarkably increasing impact strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.