Condensed polycyclic, polynuclear aromatic thermosetting resin having good moldability and heat resistance; and preparation thereof
US5017683A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1989 |
| Grant date | May 21, 1991 |
| Priority date | — |
| Expiry date | Aug 25, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2365/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A condensed polycyclic, polynuclear aromatic thermosetting resin with improved moldability which is prevented from forming a cloud on a mold during molding is disclosed. The resin is a prepolymer derived by condensation polymerization of a condensed polycyclic aromatic compound or a mixture thereof with a monocyclic aromatic compounds and an aromatic compound having at least two hydroxymethyl groups as a crosslinking agent in the presence of an acid catalyst. The resin has a flow temperature of not higher than 150.degree. C. The acid catalyst is water-insoluble or when it is water-soluble the resin has an insolubilized acid ratio of at least 50%. The resin is useful in the manufacture of thermoset molded articles having good heat resistance and good mechanical and electrical properties. It can be blended with a filler and/or reinforcing agent to form a molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.