Rotary digital contact encoder substrate
US5017741A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1989 |
| Grant date | May 21, 1991 |
| Priority date | — |
| Expiry date | Mar 29, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03M1/301
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A rotary digital contacting encoder (FIG. 1) including a base (5), comprising - a base epoxy disk (501) with three external, pre-molded in place, connector pins (P.sub.1 -P.sub.3) on its exterior side extending through it, and a conductive layer in the form of two concentric layer rings (502 & 503; FIG. 4); and - an encoder element made of a "Kapton" insulating substrate (510) carrying two, like concentric cog rings (511B & 511A; FIGS. 3 & 7) on its top side. Conductive vias (512 & 513) electrically interconnect each respective cog ring with its respective conductive layer ring and its respective external connector pin, the vias forming conductive paths through the insulating substrate between the conductive layer and the cog rings. The presence of the conductive layer 502/503, which can be screen printed on the base disk, greatly simplifies the relative alignment of the encoder element, conductor pads and terminals. Using the conductive layer the encoder element can be positioned at almost any angular location, while still obtaining proper electrical contact with the terminal pins. The via tunnels are etched out (FIG. 6A) and then filled with conductive materials before the encode…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.