IC card having circuit modules for mounting electronic components
US5018051A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 1988 |
| Grant date | May 21, 1991 |
| Priority date | — |
| Expiry date | Dec 28, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector terminal pattern formed thereon, circuit modules embedded in the recess portions in main substrate, each module having electronic components including IC chips, a chip capacitor and a thin D.C. battery unit, and a double-layered wiring structure for providing electric connection between the electronic components and the connector terminal pattern. The double-layered wiring structure comprises a first wiring layer formed on the main substrate to cover the circuit modules and a second wiring layer formed insulatively above the former wiring layer. The first wiring layer has a first wiring pattern that extends in a first direction of the main substrate to be coupled to the electronic components. The second wiring layer has a second wiring pattern that extends in a second direction of the main substrate to be coupled to the first wiring pattern and the connector terminal pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.