Apparatus for wet etching of thin films

US5019205A · kind A · utility

Assignee

• TEXAS INSTRUMENTS DEUTSCHLAND GMBH · DE

Inventors

• Helmut Endl · Freising, DE
• Helmut Rinck · Moosburg an der Isar, DE

Key dates

• Filing date: Jun 9, 1989
• Grant date: May 28, 1991
• Expiry date: Jun 9, 2009

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B05B13/0257
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An apparatus for wet etching of thin films with which etching rate differences as between various regions of a respective thin film down to only 5% can be achieved. The apparatus includes a housing (10) providing a liquid treatment chamber in which at least one rotational-symmetrical basket (12; 14) is arranged for accommodating semiconductor slices (16) having the thin films to be etched. The basket (12, 14) rests on two rollers (18, 20; 22), one of which is driven. Longitudinally above the basket (12; 14), flat jet nozzles (24) are arranged in such a manner that the jets of etching solution sprayed out of the nozzles form a homogeneous flat jet (26). The flat jet (26) is directed laterally in the direction of the axis of symmetry of the basket (12; 14). With this apparatus, overflow conditions on the surfaces of the slices (16) to be processed are obtained which are so uniform that the apparatus is suitable for use in the wet etching of aluminium layers in device fabrication.