Thermoplastic molding materials based on polyphenylene ethers and nylons

US5019626A · kind A · utility

Assignee

• BASF SE

Inventors

• Christof Taubitz · Monsheim, DE
• Hermann Gausepohl · Mutterstadt, DE
• Erhard Seiler · Ludwigshafen, DE
• Klaus Boehlke
• Walter Heckmann · Weinheim, DE

Key dates

• Filing date: Feb 26, 1988
• Grant date: May 28, 1991
• Expiry date: Feb 26, 2008

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S525/905
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain, as essential components, PA1 A) 5-92% by weight of a polyphenylene ether which can contain up to 50% by weight of a styrene polymer which differs from C), PA1 B) 5-92% by weight of a nylon, PA1 C) 3-50% by weight of a copolymer composed of C.sub.1) 97-99.9% by weight of styrene and/or substituted styrenes of the general formula I ##STR1## where R is hydrogen, alkyl of 1 to 8 carbon atoms or halogen, R.sup.1 is alkyl of 1 to 8 carbon atoms or halogen and n is 0, 1, 2 or 3, PA2 C.sub.2) 0.1-3% by weight of an .alpha.,.beta.-unsaturated dicarbonyl compound and PA2 C.sub.3) 0-10% by weight of further, nonionic comonomers, and PA1 D) 0-35% by weight of a rubber impact modifier.