Mounting substrate and its production method, and printed wiring board having connector function and its connection method
US5019944A · kind A · utility
94Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 1989 |
| Grant date | May 28, 1991 |
| Priority date | — |
| Expiry date | May 25, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to a mounting substrate onto which components such as an IC chip are to be mounted, its production method, and a printed wiring board having a connector function suitable for a fine pitch and its connection method. Metal nodules are formed on conductors of connection portions by electrodeposition, or the like. Connection is made by fixing connection portions by an adhesive. Good conduction can be secured through the metal nodules and good insulation can be held between adjacent conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.