Microenvironmental sensors
US5020376A · kind A · utility
1Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1988 |
| Grant date | Jun 4, 1991 |
| Priority date | — |
| Expiry date | Jan 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49007
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of making a microenvironmental sensor for neurological use in which the sensor is formed on a silicon wafer by the use of known integrated circuit techniques. A mask is applied to define the outline of the sensor, trenches are etched surrounding the sensor by the use of an anisotropic etchant and the sensor is separated by etching surplus silicon from the rear surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.